Process Excursion could be a result of one or more of a degrading equipment part, a process or equipment issue of the wafer/die from any of the previous steps, etc. Detecting such excursions and notifying appropriate fab or assembly/test personnel could result in preventing yield loss, improving cycle-time, OEE and equipment up-time
eInnoSys has successfully implemented several Fault Detection & Classification (FDC) projects at various fabs.
Case Study:
At one wafer fab, eInnoSys implemented Fault Detection and Classification (FDC) system with cost savings of $120k per year